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1. Super Cooling Hardware Configuration: Equipped with a extra-large refrigeration chip (thicker grains, higher efficiency), paired with a 7-blade high-speed fan, large-area heat sink and copper cold guide plate. It achieves a single-body cooling temperature difference of 40 degrees Celsius, dropping to 0 degrees Celsius in 30 seconds at 25 degrees Celsius room temperature, with a minimum cooling temperature of -15 degrees Celsius.
2. 27W High-Power Cooling Technology: Upgraded semiconductor refrigeration technology with a customized TEC chip delivers 27W high power, enabling fast and long-lasting cooling to continuously suppress phone overheating.
3. Intelligent Temperature Control & Protection: Supports stepless intelligent temperature control for precise monitoring and regulation to prevent condensation; equipped with dual NTC over-temperature protection that automatically cuts off power when overheated. It also offers 3 temperature control modes (Overclocking, Smart, Quiet) for one-touch fast switching.
4. Multi-Scene Adaptation Design: Features a bolt structure on the side, which can be fixed on handheld gimbals or camera stands, compatible with gaming, live streaming, daily use, etc.; the upper and lower air outlet design prevents hot air from scalding hands, improving holding comfort.
5. High Energy Efficiency & Performance Advantages: The actual equivalent cooling capacity reaches 11W, with an energy efficiency ratio of over 40% – surpassing ordinary market coolers (energy efficiency ratio <= 30%), and it can stabilize the phone’s frame rate during long-term use.
